FPT Advanced Semiconductor Testing and Packaging Plant in Bac Ninh province (Photo: VOV)

The plant is located in Yen Phong II-C Industrial Park, Bac Ninh province. In Phase 1 (2026–2027), it will cover an area of 1,600 square metres, comprising six functional testing lines (ATE tester & handler) and one area equipped with multiple reliability testing and specialized durability testing systems.

In Phase 2 (2028–2030), FPT plans to expand the plant to about 6,000 square metres and invest in 18 additional functional testing lines, three reliability and durability testing areas, and advanced packaging lines, raising capacity to billions of products per year.

FPT will also strengthen testing capabilities for high-end chips serving the Internet of Things (IoT), automotive applications, and edge AI SoC (system-on-chip integrating AI at the edge).

Speaking at the ceremony, Deputy Minister of Science and Technology Bui Hoang Phuong said the FPT plant will fill in Vietnam’s semiconductor ecosystem.

Inside the FPT Advanced Semiconductor Testing and Packaging Plant (Photo: VOV)
At the event, FPT signed a comprehensive cooperation agreement with the Military Industry and Telecommunications Group (Viettel) to build self-reliant semiconductor technology capabilities by integrating the semiconductor industry value chain, including training, design, fabrication, testing, packaging and commercialization. They will jointly develop 28–32nm edge AI SoC chips for ecosystems of cameras, drones, unmanned aerial vehicles (UAVs) and smart devices.

The establishment of FPT’s advanced semiconductor chip testing and packaging factory demonstrates FPT’s commitment to implementing Resolution 57 on breakthroughs in science and technology development, innovation and national digital transformation, and the National Strategy for Semiconductor Industry Development.

The factory is expected to provide hands-on practice and experimentation opportunities for semiconductor students in Vietnam, contributing to improving the quality of semiconductor human resource training and supporting the goal of training 50,000 semiconductor personnel by 2030, including at least 35,000 personnel in manufacturing, packaging, testing and other stages of the semiconductor industry.